What Are You Looking For?
Enter the Era of Mini LED
Leading the future of display
Full Flip Chip Stable and reliable
By adopting COB and full flip RGB chip, the production process eliminates the need for wire-bonding, shortens the process path, and ensures the stability and reliability of the product.
Dynamic energy saving Efficient operation
The full flip-chip and COB encapsulation technology provides excellent heat dissipation for the chip, resulting in high efficiency. When combined with a constant current driving IC, it achieves energy-saving and high-efficiency performance.
Soft Surface Light Source Pure Color Clear Image
Uniform illumination, soft and non-glaring light source, less likely to cause visual fatigue; high contrast, 3840Hz high refresh rate, providing a high-definition and delicate viewing experience.
COB Encapsulation High protection level
Using COB encapsulation technology, the screen surface is smooth and flat, the surface of module has an IP65 protection level, which is resistant to impact, water, moisture, and static electricity, and can be cleaned with dish cloth.
Product Parameters
| Mode | QD2707 | QD2709 | QD2712 |
| Pixel Pitch (mm) | 0.78 | 0.9375 | 1.25 |
| Resolution(dots) | 768*432 | 640*360 | 480*270 |
Enter the Era of Mini LED Leading the future of display
Premium choice for commercial application Low Power Consumption | Right Angle Splicing | Various Installation Mode | Temperature Monitoring
IPv6 network supported